The ESAS Winter school on Novel Frontiers in Superconducting Electronics: from Fundamental Concepts and Advanced Materials towards Future Applications offers a unique possibility to learn, in a relatively short time and by direct interaction with highly qualified experts, the novel trends and the latest developments at the frontier of science where fundamental physical effects, advanced materials, novel device concepts and methodologies in nanotechnology can lead to innovative solutions for facing the needs and the challenges of a futuristic electronics employing superconducting phenomena and technologies. The scope of the school is to bridge the world of fundamental phenomena and advanced materials to technological applications with the aim to provide a background and a vision on futuristic concept devices and related applications.
The follwoing lecturers will participate :
Mukhanov (Hypres Inc, USA)
Vernik (Hypres Inc, USA)
Ortlepp (CiS Forschungsinstitut für MikrosensorikGmbH - Erfurt, Germany)
Giazotto (CNR NANO - Pisa, Italy)
Aarts (University of Leiden, The Netherlands)
Tanaka (Nagoya University, Japan)
Robinson (University of Cambridge, UK)
Lombardi (Chalmers University, Sweden)
Kimel (Radboud University, The Netherlands)
Sobolewski (University of Rochester, USA)
Boschker (Max Planck Institute Stuttgart, Germany)
Their lectures will cover the following topics:
Toward energy-efficiency electronics;
Interfacing superconductivity with other functional degrees of freedom (spin, light, quantum topology, ferroelectricity, caloritronics);
Superconducting fast interconnections down to low dimensional nanostructures, nanowires, 2D one-layer materials;
Methodologies for the design of nanostructures based on advanced materials
The maximum number of students has been set to about 30. Applications are to be sent to Adriana Santroni (email@example.com) up to October 15, 2016, together with a short CV and a presentation letter by a supervisor or an exponent of the home institution. For non-local participants a contribution to help covering the participation expenses is available.
For further information on application fee, please refer to events.isec2017.org .